PACKAGING INFORMATION

Rev. F

10/29/03

Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time

without notice.

ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to

obtain the latest version of this device specification before relying on any published information and before placing orders for products.

400-mil Plastic SOJ

Package Code: K

Notes:

1. Controlling dimension:

millimeters.

2. BSC = Basic lead spacing

between centers.

3. Dimensions D and E1 do not

include mold flash protrusions

and should be measured from

the bottom of the package.

4. Reference document: JEDEC

MS-027.

SEATING PLANE

1

N

E1

D

E2

E

B

e

A1

A

C

A2

b

N/2+1

N/2

Millimeters

Inches

Millimeters

Inches

Millimeters

Inches

Symbol

Min

Max

Min

Max

Min

Max

Min

Max

Min

Max

Min

Max

No. Leads (N)

28

32

36

A

3.25

3.75

0.128

0.148

3.25

3.75

0.128 0.148

3.25

3.75

0.128 0.148

A1

0.64

—

0.025

—

0.64

—

0.025

—

0.64

—

0.025

—

A2

2.08

—

0.082

—

2.08

—

0.082

—

2.08

—

0.082

—

B

0.38

0.51

0.015

0.020

0.38

0.51

0.015 0.020

0.38

0.51

0.015 0.020

b

0.66

0.81

0.026

0.032

0.66

0.81

0.026 0.032

0.66

0.81

0.026 0.032

C

0.18

0.33

0.007

0.013

0.18

0.33

0.007 0.013

0.18

0.33

0.007 0.013

D

18.29 18.54

0.720

0.730

20.82

21.08

0.820 0.830

23.37 23.62

0.920 0.930

E

11.05 11.30

0.435

0.445

11.05

11.30

0.435 0.445

11.05 11.30

0.435 0.445

E1

10.03 10.29

0.395

0.405

10.03

10.29

0.395 0.405

10.03 10.29

0.395 0.405

E2

9.40 BSC

0.370 BSC

9.40 BSC

0.370 BSC

9.40 BSC

0.370 BSC

e

1.27 BSC

0.050 BSC

1.27 BSC

0.050 BSC

1.27 BSC

0.050 BSC