M24256-A

2/20

Figure 2A. DIP Connections

Note: 1. NC = Not Connected

Figure 2B. SO Connections

Note: 1. NC = Not Connected

SDA

VSS

SCL

WC

E1

E0

VCC

NC

AI02273C

M24256-A

1

2

3

4

8

7

6

5

1

AI02272C

2

3

4

8

7

6

5

SDA

VSS

SCL

WC

E1

E0

VCC

NC

M24256-A

Figure 2C. TSSOP Connections

Note: 1. NC = Not Connected

Figure 2D. SBGA Connections (top view)

1

AI02388C

2

3

4

14

9

10

8

SDA

VSS

NC

SCL

E0

WC

M24256-A

NC

E1

NC

NC

NC

NC

NC

5

6

7

12

13

11

VCC

AI03760

SCL

VSS

SDA

WC

VCC

M24256-A

S1

S0

Note: 1. Except for the rating “Operating Temperature Range”, stresses above those listed in the Table “Absolute Maximum Ratings” may

cause permanent damage to the device. These are stress ratings only, and operation of the device at these or any other conditions

above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating condi-

tions for extended periods may affect device reliability. Refer also to the ST SURE Program and other relevant quality documents.

2. IPC/JEDEC J-STD-020A

3. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500

Ω, R2=500 Ω)

4. EIAJ IC-121 (Condition C) (200 pF, 0

Ω)

Symbol

Parameter

Value

Unit

Ambient Operating Temperature

–40 to 125

°C

Storage Temperature

–65 to 150

°C

Lead Temperature during Soldering

PDIP: 10 seconds

260

235

235

°C

Input or Output range

–0.6 to 6.5

V

Supply Voltage

–0.3 to 6.5

V

4000

V

200

V