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ISO6442FDFPR Datasheet(PDF) 36 Page - Texas Instruments |
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ISO6442FDFPR Datasheet(HTML) 36 Page - Texas Instruments |
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36 / 56 page ![]() www.ti.com PACKAGE OUTLINE C 10.63 9.97 TYP 2.55 MAX 14X 1.27 16X 0.456 0.356 2X 8.89 (0.152) TYP 1 - 5 0.25 0.15 (1.4) 0.25 GAGE PLANE 0.962 0.708 A 10.5 10.1 NOTE 3 B 7.6 7.4 NOTE 4 4231632/A 02/2025 SOIC - 2.55 mm max height DW0016C-C01 SMALL OUTLINE INTEGRATED CIRCUIT NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side. 5. Reference JEDEC registration MS-013. 1 16 0.25 C A B 9 8 PIN 1 ID AREA SEATING PLANE 0.1 C SEE DETAIL A TYPICAL DETAIL A SCALE 1.500 ISO6440, ISO6441, ISO6442 SLLSG01B – SEPTEMBER 2024 – REVISED NOVEMBER 2025 www.ti.com 36 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated Product Folder Links: ISO6440 ISO6441 ISO6442 |
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