ISO6442FDFPR datasheet(10/56 Pages) TI2

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6.7 Safety-Related Certifications

VDE

CSA

CQC

TUV

Plan to certify according

to DIN EN IEC 60747-17

(VDE 0884-17)

Plan to certify according

to IEC 62368-1, IEC

61010-1 and IEC 60601

Plan to certify according

to UL 1577 Component

Recognition Program

Plan to certify according to

GB4943.1

Plan to certify according

to EN 61010-1 and EN

62368-1

Certificate planned

6.8 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

DW-16 Package

Safety input, output, or supply current

RθJA = 83°C/W, VI = 5.5V, TJ = 150°C, TA

= 25°C

273.8

RθJA = 83°C/W, VI = 3.6V, TJ = 150°C, TA

= 25°C

418.3

RθJA = 83°C/W, VI = 2.75V, TJ = 150°C,

TA = 25°C

547.6

Safety input, output, or total power

RθJA = 83°C/W, TJ = 150°C, TA = 25°C

1506

Maximum safety temperature

150

°C

DFP-16 Package

Safety input, output, or supply current

RθJA = 113.3°C/W, VI = 5.5V, TJ = 150°C,

TA = 25°C

200.6

Safety input, output, or supply current

RθJA = 113.3°C/W, VI = 3.6V, TJ = 150°C,

TA = 25°C

306.5

Safety input, output, or supply current

RθJA = 113.3°C/W, VI = 2.75V, TJ =

150°C, TA = 25°C

401.2

Safety input, output, or total power

RθJA = 113.3°C/W, TJ = 150°C, TA = 25°C

1103.3

Maximum safety temperature

150

°C

DBQ-16 Package

Safety input, output, or supply current

RθJA = 117.8°C/W, VI = 5.5V, TJ = 150°C,

TA = 25°C

192.9

Safety input, output, or supply current

RθJA = 117.8°C/W, VI = 3.6V, TJ = 150°C,

TA = 25°C

294.8

Safety input, output, or supply current

RθJA = 117.8°C/W, VI = 2.75V, TJ =

150°C, TA = 25°C

385.9

Safety input, output, or total power

RθJA = 117.8°C/W, TJ = 150°C, TA = 25°C

1061.1

Maximum safety temperature

150

°C

(1)

The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The

IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS should not be

exceeded. These limits vary with the ambient temperature, TA.

The junction-to-air thermal resistance, RθJA, in the table is that of a device installed on a high-K test board for leaded surface-mount

packages. Use these equations to calculate the value for each parameter:

TJ = TA + RθJA × P, where P is the power dissipated in the device.

TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.

PS = IS × VI, where VI is the maximum input voltage.

ISO6440, ISO6441, ISO6442

SLLSG01B – SEPTEMBER 2024 – REVISED NOVEMBER 2025

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