DIA2240

Version 1.1, Apr 2026

www.dioo.com

© 2026 Dioo Microcircuits Co., Ltd. Jiangsu

3

5. Thermal Considerations

The thermal resistance determines the heat insulation property of a material. The higher the thermal

resistance is, the lower the heat loss. Accumulation of heat energy degrades the performance of

semiconductor components.

Symbol

Metric

Value

Unit

RθJA

Junction-to-ambient thermal resistance

TSSOP-8

149

°C/W

SOIC-8

33

°C/W

RθJC

Junction-to-case thermal resistance

TSSOP-8

113

°C/W

SOIC-8

52

°C/W

6. Electrical Characteristics

TA = 25 °C, VS = 5 V, VSENSE = VIN+ - VIN-, VCM = 12 V, and VREF1 = VREF2 = VS / 2, unless otherwise noted.

Symbol

Parameter

Test Conditions

Min

Typ

Max

Unit

Power supply

VS

Operating voltage

2.7

5.5

V

IQ

Quiescent current

VSENSE = 0 mV

1.8

2.4

mA

IQ vs. temperature, TA = -40°C to 125°C

2.6

mA

Input

VCM

Common-mode input

range

VIN+ = -4 V to 80 V, VSENSE = 0 mV,

TA = - 40°C to 125°C

-4

110

V

CMRR

Common-mode

rejection ratio

VIN+ = -4 V to 80 V, VSENSE = 0 mV,

TA = - 40°C to 125°C

120

132

dB

f = 50 kHz

93

dB

VOS

Offset voltage, RTI (1)

VSENSE = 0 mV,

VS = 2.5 V, GND = -2.5 V, VCOM = 0

±5

±25

µV

dVOS/dT

Offset voltage drift

VSENSE = 0 mV, TA = -40°C to 125°C

±50

nV/°C

PSRR

Power-supply

rejection ratio

VS = 2.7 V to 5.5 V, VSENSE = 0 mV

±2

µV/V

IB

Input bias current

VSENSE = 0 mV

88

µA

Reference input

range

0

VS

V

Output

G

Gain

DIA2240A

20

V/V

DIA2240B

50

V/V

DIA2240C

100

V/V

DIA2240D

200

V/V