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ISOTMP35RDFPR Datasheet(PDF) 26 Page - Texas Instruments

Part # ISOTMP35RDFPR
Description  ISOTMP35R ±2.0°C, 5kVRMS Reinforced Isolated, Analog Temperature Sensor (10mV/°C) With Fast Response Time (< 4s) and 1.06kVRMS Working Voltage
PDF  44 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

ISOTMP35RDFPR Datasheet(HTML) 26 Page - Texas Instruments

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8.1.5.1 Filtering Techniques
EMI mitigation begins at the schematic level. Low-pass filtering can be applied to the VOUT signal path to
attenuate high-frequency noise before the signal reaches the ADC.
A typical implementation includes a capacitor (CLOAD) placed at the VOUT pin and an RC filter located near the
ADC input. The capacitor at the device output provides local high-frequency filtering and reduces output noise.
Because this capacitor directly loads the output stage, the CLOAD value must be selected in accordance with the
capacitive-load drive capability described in Section 7.3.2.2.
A series resistor (RISO) is used to isolate the sensor output from downstream capacitance and improve stability.
When RISO is greater than or equal to 300Ω, the output maintains a phase margin of at least 45° across the full
capacitive-load range, allowing greater flexibility in downstream filtering.
The RC network at the ADC input attenuates high-frequency noise and isolates the sensor output from ADC
sampling transients. Additional RC filtering stages can be used in applications with long routing distances or
elevated noise levels.
Optional ferrite beads can be inserted in the signal path or supply path to suppress high-frequency interference.
The use of ferrite beads must be evaluated at the system level, as frequency-dependent impedance can
introduce signal distortion if not properly selected.
Figure 8-3 shows an example multi-stage filtering configuration intended for high-EMI environments or systems
with long signal routing distances. In most applications, a single RC stage at the ADC input combined with a
properly selected RISO is sufficient.
Keep space beneath
device free of any planes,
traces, pads and vias
VDD
VOUT
GND
NC
NC
NC
ISOTMP35R
1
2
3
4
5
6
7
8
9
10
11
12
Heat
High Voltage Heat Source
GND
GND
CFLT_2
RFLT_2
RFLT_1
CFLT_1
CLOAD
ADC
GND
GND
CFLT_3
+
–
3.1V to 34V
GND
GND
CBYPASS
GND
FB
OPTIONAL
OPTIONAL
RISO
RFLT_3
Figure 8-3. Example Multi-Stage Filtering Configuration for High-EMI Environments
In most applications, filtering on VDD and VOUT is sufficient to achieve good noise performance. Filtering on the
ground path is generally not required unless significant ground noise is present, as ground-path filtering can
introduce DC offsets that affect measurement accuracy.
8.1.5.2 Design Guidelines for EMI Filtering
The filtering configuration shown in Figure 8-3 illustrates a scalable approach that can be adapted based on
system noise conditions and routing requirements. At a minimum, a capacitor (CLOAD) can be placed at the VOUT
pin to provide local high-frequency filtering. Because this capacitor directly loads the output stage, the capacitor
value must be selected in accordance with the capacitive-load drive capability described in Section 7.3.2.2. In
applications without a series isolation resistor, the total effective capacitance seen at VOUT must not exceed
2.2nF.
A series isolation resistor (RISO), shown in Figure 8-3, is recommended for applications with downstream
filtering, long trace lengths, or unknown capacitive loading. When RISO is greater than or equal to 300Ω, the
output maintains a phase margin of at least 45° across the full capacitive-load range, allowing greater flexibility
in downstream filtering.
ISOTMP35R
SNIS244A – SEPTEMBER 2025 – REVISED MAY 2026
www.ti.com
26
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Copyright © 2026 Texas Instruments Incorporated
Product Folder Links: ISOTMP35R



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