10.5 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

10.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

10.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

11 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision * (December 2025) to Revision A (March 2026)

Page

• Updated status of the data sheet to mixed status for both production and advanced information devices, refer

to the Packaging Information table on the Package Option Addendum page in the Mechanical, Packaging,

and Orderables section for Production or Preproduction status for specific device and package. Added small

form factor packages Wide-SSOP (DFP-16) and SSOP (DBQ-16) to document. .............................................1

• Updated the CMTI minimum and typical values, updated part to part skew maximum values and removed

clock jitter throughout the document. .................................................................................................................1

• Deleted planned CSA certification and added planned UL 1577 and CSA CAS Notice No. 5A certification

throughout the document. Removed IEC 60601-1 from planned certifications. ................................................ 1

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1

• Updated the part to part skew for 2.5V, 3.3V and 5V VCC maximum values and updated the time interval error

(tie) typical values for all VCCs in the Switching Characteristics sections. ..........................................................5

• Updated the minimum and typical CMTI values for all VCCs and updated the typical values for input

capacitance (CI) for all VCCs in Electrical Characteristics sections. ...................................................................5

• Updated the maximum ICC1 and ICC2 values for all VCCs in the Supply Current sections for 10Mbps, 25Mbps

and 100Mbps. Added typical ICC ICC1 and ICC2 values for all VCCs in the Supply Current sections.................. 5

• Added the Insulation Characteristics Curves section to the document............................................................ 23

• Added the Typical Characteristics section to the document............................................................................. 25

• Added the Application Curve section to the document.....................................................................................34

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

ISO6041

SLLSFV3A – DECEMBER 2025 – REVISED MARCH 2026

www.ti.com

38

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