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ISO6040HDFPR Datasheet(PDF) 47 Page - Texas Instruments |
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ISO6040HDFPR Datasheet(HTML) 47 Page - Texas Instruments |
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47 / 52 page ![]() www.ti.com EXAMPLE STENCIL DESIGN 16X (.063) [1.6] 16X (.016 ) [0.41] 14X (.0250 ) [0.635] (.213) [5.4] SHRINK SMALL-OUTLINE PACKAGE SSOP - 1.75 mm max height DBQ0016A 4214846/A 03/2014 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.127 MM] THICK STENCIL SCALE:8X SYMM SYMM 1 8 9 16 www.ti.com ISO6041 SLLSFV3A – DECEMBER 2025 – REVISED MARCH 2026 Copyright © 2026 Texas Instruments Incorporated Submit Document Feedback 47 Product Folder Links: ISO6041 |
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