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KB-HHLSU1-14 Datasheet(PDF) 13 Page - ams-OSRAM AG |
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KB-HHLSU1-14 Datasheet(HTML) 13 Page - ams-OSRAM AG |
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13 / 22 page ![]() KB HHLSU1.14 DATASHEET DATASHEET 13 | Version 1.1 | 2026-07-02 Recommended Solder Pad 7) For protection during reflow soldering and handling a foil is attached to the device. The foil has to be removed before opera- tion. For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. To ensure a high solder joint reliability and to minimize the risk of solder joint cracks, the customer is responsible to evaluate the combina- tion of PCB board and solder paste material for his application. |
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