DA7282-00FVC datasheet(14/75 Pages) RENESAS

Part #	DA7282-00FVC

Description	LRA/ERM Ultra-Low Power Haptic Driver with Multiple Input Triggers and Integrated Waveform Memory

PDF	75 Pages

Scroll/Zoom	100%

Manufacturer	RENESAS [Renesas Technology Corp]

Direct Link	http://www.renesas.com

Logo

14 / 75 page

LRA/ERM Ultra-Low Power Haptic Driver with Multiple Input Triggers and Integrated Waveform Memory

R15DS0041EE0330 Rev.3.30

June 16, 2026

CFR0011-120-00

Page 14

5.5

Thermal Specifications

Table 10. WLCSP thermal ratings

Parameter

Description (Note 1)

Min

Typ

Max

Unit

RƟJA

Junction-to-ambient thermal resistance

90.3

°C/W

RƟJC_TOP

Junction-to-case (top) thermal resistance

43.6

°C/W

RƟJB

Junction-to-board thermal resistance

49.0

°C/W

JT

Junction-to-top characterization parameter

6.4

°C/W

JB

Junction-to-board characterization parameter

45.8

°C/W

Note 1

Multilayer JEDEC standard, still air, ambient temperature 25 °C, simulated value.

Table 11. QFN thermal ratings

Parameter

Description (Note 1)

Min

Typ

Max

Unit

RƟJA

Junction-to-ambient thermal resistance

88.2

°C/W

RƟJC_TOP

Junction-to-case (top) thermal resistance

54.6

°C/W

RƟJB

Junction-to-board thermal resistance

39.3

°C/W

JT

Junction-to-top characterization parameter

3.4

°C/W

JB

Junction-to-board characterization parameter

50.0

°C/W

RƟJC_BOTTOM

Junction-to-case (bottom) thermal resistance

4.4

°C/W

Note 1

Multilayer JEDEC standard, still air, ambient temperature 25 °C, simulated value.

DA7282-00FVC Datasheet(PDF) 14 Page - Renesas Technology Corp

DA7282-00FVC Datasheet(HTML) 14 Page - Renesas Technology Corp

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75

Datasheet Download

Link URL