Many of the data book types with diameter

≥ 64.3 mm can be ordered in low-inductance design

with inductance approx. L = 13 nH.

For low-inductance design the following deviation regarding case dimensions applies:

d = 64.3 mm: l1

0.7 mm

d = 90.0 mm: l1

1.7 mm

M5: Min. reach of screw = 9.0 mm

M6: Min. reach of screw = 9.5 mm

5.3

Capacitors with heat sink mounting (M607, M657)

As a large amount of heat is dissipated through the base of the case, the use of a heat sink con-

nected to the capacitor base is the most efficient cooling method. For heat-sink mounting we offer

a special optimized version of high-voltage capacitors with screw terminals in order to ensure an

optimal heat transfer between the base of the case and the heat sink. The special design com-

prises:

Two thermal pads at the base. The first one (thickness 0.5 mm) closes the air gap at the base

in the area which is not covered by the insulating sleeve and the second one (thickness

0.2 mm) ensures the electrical insulation of the case.

Minimized tolerance (

±0.35 mm) of the overall length l

1 of the capacitor to avoid unwanted me-

chanical forces on the terminals particularly when several capacitors are mounted between

heat sink and bus bar.

Case with extra groove near the base for ring clamp mounting (recommended accessory

B44030A0165-A0190B). The clamp ensures an optimal pressing of the case to the heat sink.

Most of the high-voltage data book types without threaded stud and for diameters

≥ 64.3 mm

can be ordered in heat-sink mounting design.

Please refer to chapter "General technical information, 5.2.2 Base cooling with heat sink". Re-

garding ripple current and useful life, please refer to chapter "General technical information,

5 Useful life".

B43712, B43732

Long useful life

85

°C

Page 14 of 30

Please read Cautions and warnings and

Important notes at the end of this document.