AD9388ABSTZ-5P datasheet(9/28 Pages) AD

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AD9388A

Rev. B | Page 9 of 28

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

Table 4.

Parameter

Rating

AVDD to AGND

2.2 V

DVDD to DGND

2.2 V

PVDD to PGND

2.2 V

DVDDIO to DGND

4 V

CVDD to CGND

2.2 V

TVDD to TGND

4 V

DVDDIO to AVDD

−0.3 V to +3.6 V

DVDDIO to TVDD

−3.6 V to +3.6 V

DVDDIO to DVDD

−2 V to +2 V

CVDD to DVDD

−2 V to +0.3 V

PVDD to DVDD

−2 V to +0.3 V

AVDD to CVDD

−2 V to +2 V

AVDD to PVDD

−2 V to +2 V

AVDD to DVDD

−2 V to +2 V

AVDD to TVDD

−3.6 V to +0.3 V

TVDD to DVDD

−2 V to +2 V

Digital Inputs

Voltage to DGND

DGND − 0.3 V to DVDDIO + 0.3 V

Digital Outputs

Voltage to DGND

DGND − 0.3 V to DVDDIO + 0.3 V

Analog Inputs

Voltage to AGND

AGND − 0.3 V to AVDD + 0.3 V

Maximum Junction

Temperature (TJ_MAX)

125°C

Storage Temperature Range

−65°C to +150°C

Infrared Reflow,

Soldering (20 sec)

260°C

Table 5.

Package Type

ΨJT1

Unit

144-Lead LQFP (ST-144)

1.62

°C/W

1 Junction-to-package surface thermal resistance.

PACKAGE THERMAL PERFORMANCE

To reduce power consumption during AD9388A operation,

turn off unused ADCs.

On a four-layer PCB that includes a solid ground plane, the θJA

value is 25.3°C/W. However, due to variations within the PCB

metal and, therefore, variations in PCB heat conductivity, the

value of θJA may differ for various PCBs.

The most efficient measurement technique is to use the surface

temperature of the package to estimate the die temperature

because this is not affected by the variance associated with the

θJA value.

The maximum junction temperature (TJ_MAX) of 125°C must not

be exceeded. The following equation calculates the junction

temperature using the measured surface temperature of the

package and applies only when no heat sink is used on DUT:

TJ_MAX = TS + (ΨJT × WTOTAL)

where:

TS is the surface temperature of the package expressed in

degrees Celsius.

ΨJT is the junction-to-package surface thermal resistance.

WTOTAL = {(AVDD × IAVDD) + (DVDD × IDVDD) + (DVDDIO

× IDVDDIO) + (PVDD × IPVDD) + (CVDD × ICVDD) +

(TVDD × ITVDD)}.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Contact an Analog Devices, Inc., representative for more details

on package thermal performance at video.products@analog.com.

ESD CAUTION

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