ADP121 datasheet(17/20 Pages) AD

17 / 20 page

ADP121

Rev. 0 | Page 17 of 20

VIN

VOUT

GND

ANALOG DEVICES

ADP121-xx-EVALZ

140

120

100

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

VIN – VOUT (V)

MAX JUNCTION TEMPERATURE

LOAD CURRENT = 1mA

LOAD CURRENT = 10mA

LOAD CURRENT = 25mA

LOAD CURRENT = 50mA

LOAD CURRENT = 75mA

LOAD CURRENT = 100mA

LOAD CURRENT = 150mA

Figure 46. TSOT, 100 mm2 of PCB Copper, TA = 85°C

140

120

100

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

VIN – VOUT (V)

MAX JUNCTION TEMPERATURE

LOAD CURRENT = 1mA

LOAD CURRENT = 10mA

LOAD CURRENT = 25mA

LOAD CURRENT = 50mA

LOAD CURRENT = 75mA

LOAD CURRENT = 100mA

LOAD CURRENT = 150mA

Figure 47. WLCSP, 100 mm2 of PCB Copper, TA = 85°C

Figure 48. Example of TSOT PCB Layout

WLC

ADP121CB-xx-EVALZ

GND

VIN

VOUT

PRINTED CIRCUIT BOARD LAYOUT

CONSIDERATIONS

Heat dissipation from the package can be improved by increasing

the amount of copper attached to the pins of the ADP121. How-

ever, as can be seen from Table 5 and Table 6, a point of

diminishing returns is eventually reached, beyond which

an increase in the copper size does not yield significant heat

dissipation benefits.

Figure 49. Example of WLCSP PCB Layout

Place the input capacitor as close as possible to the VIN and

GND pins. Place the output capacitor as close as possible to the

VOUT and GND pins. Use 0402 or 0603 size capacitors and

resistors to achieve the smallest possible footprint solution on

boards where area is limited.

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