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IMX27L Datasheet(PDF) 1 Page - Freescale Semiconductor, Inc |
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IMX27L Datasheet(HTML) 1 Page - Freescale Semiconductor, Inc |
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1 / 122 page  © Freescale Semiconductor, Inc., 2008. All rights reserved. Preliminary—Subject to Change Without Notice Freescale Semiconductor Data Sheet, Advance Information This document contains information on a product under development. Freescale reserves the right to change or discontinue this product without notice. Document Number: MCIMX27 Rev. 1, 1/2008 This document contains information on a new product. Specifications and information herein are subject to change without notice. i.MX27 and i.MX27L Package Information Plastic Package Case 1816-01 (MAPBGA–404) Ordering Information See Table 1 on page 4 for ordering information. 1 Introduction The MCIMX27/MCIMX27L (i.MX27 and i.MX27L) Multimedia Applications Processors represent the next step in low-power, high-performance applications processors. Unless otherwise specified, the material in this data sheet is applicable to both the i.MX27 and i.MX27L processors and is referred to singularly throughout this document as i.MX27. The i.MX27L does not include the following features: ATA-6 HDD Interface, Memory Stick Pro, VPU, MPEG-4/ H.263/H.264 HW encoder/decoder, and eMMA (PrP processing, CSC, deblock, dering). Based on an ARM926EJ-S™ microprocessor core, the i.MX27/i.MX27L processor provides the performance with low-power consumption required by modern digital devices such as the following: • Feature-rich cellular phones • Portable media players and mobile gaming machines • Personal digital assistants (PDAs) and wireless PDAs i.MX27 and i.MX27L Data Sheet Multimedia Applications Processor Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . 3 1.3 Ordering Information . . . . . . . . . . . . . . . . . 4 2 Functional Description and Application Information . . . . . . . . . . . . . . . . . 4 2.1 ARM926 Microprocessor Core Platform . . . 4 2.2 Module Inventory . . . . . . . . . . . . . . . . . . . . 5 2.3 Module Descriptions . . . . . . . . . . . . . . . . . . 9 3 Signal Descriptions . . . . . . . . . . . . . . . . . . . . 27 3.1 Power-Up Sequence . . . . . . . . . . . . . . . . 36 3.2 EMI Pins Multiplexing . . . . . . . . . . . . . . . . 37 3.3 Electrical Characteristics . . . . . . . . . . . . . 40 3.4 i.MX27/iMX27L Chip-Level Conditions . . . 41 3.5 Module-Level Electrical Specifications . . . 44 3.6 Timing Diagrams . . . . . . . . . . . . . . . . . . . 55 4 Package Information and Pinout . . . . . . . . 107 4.1 Full Package Outline Drawing . . . . . . . . 107 4.2 Pin Assignments . . . . . . . . . . . . . . . . . . . 108 5 Product Documentation . . . . . . . . . . . . . . . 121 6 Revision History . . . . . . . . . . . . . . . . . . . . . 121 |
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