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VN800STR-E Datasheet(PDF) 3 Page - STMicroelectronics |
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VN800STR-E Datasheet(HTML) 3 Page - STMicroelectronics |
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3 / 24 page ![]() 3/24 VN800S-E / VN800PT-E Figure 3. Configuration Diagram (Top View) & Suggested Connections for Unused and N.C. Pins Figure 4. Current and Voltage Conventions Table 4. Thermal Data (1) When mounted on FR4 printed circuit board with 0.5 cm2 of copper area (at least 35 µ thick) connected to all VCC pins. (2) When mounted on FR4 printed circuit board with 2 cm2 of copper area (at least 35 µ thick). (3) When mounted on FR4 printed circuit board with 0.5 cm2 of copper area (at least 35 µ thick) connected to all VCC pins. (4) When mounted on FR4 printed circuit board with 6 cm2 of copper area (at least 35 µ thick). Symbol Parameter Value Unit SO-8 PPAK Rthj-case Thermal Resistance Junction-case Max -3 °C/W Rthj-lead Thermal Resistance Junction-lead Max 30 - °C/W Rthj-amb Thermal Resistance Junction-ambient Max Max 93 (1) 78 (3)°C/W 82 (2) 45 (4)°C/W Connection / Pin Status N.C. Output Input Floating X X X X To Ground X Through 10K Ω resistor VCC VCC OUTPUT OUTPUT N.C. GND STATUS INPUT 1 4 5 8 5 4 3 2 1 STATUS OUTPUT GND INPUT VCC SO-8 PPAK INPUT IS IIN VIN VCC STATUS ISTAT VSTAT GND VCC IOUT VOUT IGND OUTPUT VF |
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