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M63155FP Datasheet(PDF) 7 Page - Renesas Technology Corp |
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M63155FP Datasheet(HTML) 7 Page - Renesas Technology Corp |
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7 / 41 page ![]() M63155FP Rev.1.0, Sep.16.2003, page 7 of 40 The boards for thermal derating evaluation Board thickness ; 1.6 mm Size ; 70 X 70 mm2 Metal material ; copper Board material ; Glass-epoxy FR-4 1 and 2 layers Metal thickness ; 18 µm T-type [2 layer] U-type [2 layer] V-type [1 layer] 1st layer [TOP view] 2nd layer [BACK view] IC mounting on the evaluation board Chip Heat sink Lead Package inner structure 52P9Y-K Conditions |
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