LTM4606MPV datasheet(17/24 Pages) LINER

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LTM4606

4606f

APPLICATIONS INFORMATION

Layout Checklist/Example

The high integration of LTM4606 makes the PCB board

layout very simple and easy. However, to optimize its

electrical and thermal performance, some layout con-

siderations are still necessary.

• Use large PCB copper areas for high current path, in-

cluding VIN, PGND and VOUT. It helps to minimize the

PCB conduction loss and thermal stress.

• Place high frequency ceramic input and output capaci-

tors next to the VD, PGND and VOUT pins to minimize

high frequency noise.

• Place a dedicated power ground layer underneath the

unit.

• Use round corners for the PCB copper layer to minimize

the radiated noise.

• To minimize the EMI noise and reduce module thermal

stress, use multiple vias for interconnection between top

layer and other power layers on different locations.

• Do not put vias directly on pads, unless they are

capped.

• Use a separated SGND ground copper area for com-

ponents connected to signal pins. Connect the SGND

to PGND underneath the unit.

• Place one or more high frequency ceramic capacitors

close to the connection into the system board.

Figure 17 gives a good example of the recommended

layout. For load current below 3A, decouple the input

and output grounds. Use vias to connect GND pads to the

bottom layer, then connect to the right side of the module

as the output GND.

Figure 17. Recommended PCB Layout

SIGNAL

GND

VOUT

VIN

GND

COUT

CIN

COUT

4606 F17

Table 4. 3.3V Output

DERATING CURVE

VIN (V)

POWER LOSS CURVE

AIR FLOW (LFM)

HEAT SINK

θJA (°C/W)

Figures 12, 14

12, 24

Figure 7

None

13.5

Figures 12, 14

12, 24

Figure 7

200

None

Figures 12, 14

12, 24

Figure 7

400

None

Figures 13, 15

12, 24

Figure 7

BGA Heat Sink

Figures 13, 15

12, 24

Figure 7

200

BGA Heat Sink

Figures 13, 15

12, 24

Figure 7

400

BGA Heat Sink

Heat Sink Manufacturer

Wakeﬁeld Engineering

Part No: LTN20069

Phone: 603-635-2800

Table 3. 1.5V Output

DERATING CURVE

VIN (V)

POWER LOSS CURVE

AIR FLOW (LFM)

HEAT SINK

θJA (°C/W)

Figures 8, 10

5, 12

Figure 6

None

13.5

Figures 8, 10

5, 12

Figure 6

200

None

Figures 8, 10

5, 12

Figure 6

400

None

Figures 9, 11

5, 12

Figure 6

BGA Heat Sink

9.5

Figures 9, 11

5, 12

Figure 6

200

BGA Heat Sink

Figures 9, 11

5, 12

Figure 6

400

BGA Heat Sink

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