TPS2205

DUAL-SLOT PC CARD POWER-INTERFACE SWITCH

FOR PARALLEL PCMCIA CONTROLLERS

SLVS128D OCTOBER 1995 – REVISED JUNE 1998

3

POST OFFICE BOX 655303

TPS2205Y chip information

This chip, when properly assembled, displays characteristics similar to those of the TPS2205. Thermal

compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. The chips may be

mounted with conductive epoxy or a gold-silicon preform.

43

2

1

27

26

25

24

23

22

21

20

19

18

17

16

14

15

13

12

11

10

9

8

7

6

5

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJ max = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

142

144

TPS2205Y

1

2

3

4

5

6

7

8

9

10

11

12

13

14

27

26

25

24

23

22

21

20

19

18

17

16

15

5V

5V

A_VPP_PGM

A_VPP_VCC

A_VCC5

A_VCC3

12V

AVPP

AVCC

AVCC

AVCC

GND

SHDN

3.3V

5V

B_VPP_PGM

B_VPP_VCC

B_VCC5

B_VCC3

12V

BVPP

BVCC

BVCC

BVCC

OC

3.3V

3.3V