ADCLK846SLASHPCBZ datasheet(6/16 Pages) AD

6 / 16 page

ADCLK846

Rev. A | Page 6 of 16

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Supply Voltage

VS to GND

2 V

Inputs

CLK and CLK

−0.3 V to +2 V

CMOS Inputs

−0.3 V to +2 V

Outputs

Maximum Voltage

−0.3 V to +2 V

Voltage Reference Voltage (VREF)

−0.3 V to +2 V

Operating Temperature Range

Ambient

−40°C to +85°C

Junction

150°C

Storage Temperature Range

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

DETERMINING JUNCTION TEMPERATURE

To determine the junction temperature on the application PCB,

use the following formula:

TJ = TCASE + (ΨJT × PD)

where:

TJ is the junction temperature (°C).

TCASE is the case temperature (°C) measured by the customer at

top center of the package.

ΨJT is indicated in Table 6.

PD is the power dissipation.

Values of θJA are provided for package comparison and PCB

design considerations. θJA can be used for a first-order

approximation of TJ by the equation

TJ = TA + (θJA × PD)

where TA is the ambient temperature (°C).

Values of θJB are provided for package comparison and PCB

design considerations.

ESD CAUTION

THERMAL PERFORMANCE

Table 6.

Parameter

Symbol

Description

Value1

Unit

Junction-to-Ambient Thermal Resistance

Still Air

Per JEDEC JESD51-2

0.0 m/sec Airflow

57.0

°C/W

Moving Air

JMA

Per JEDEC JESD51-6

1.0 m/sec Airflow

49.8

°C/W

2.5 m/sec Airflow

44.7

°C/W

Junction-to-Board Thermal Resistance

Moving Air

Per JEDEC JESD51-8

1.0 m/sec Airflow

35.2

°C/W

Junction-to-Case Thermal Resistance

Moving Air

Per MIL-STD 883, Method 1012.1

Die-to-Heat Sink

2.0

°C/W

Junction-to-Top-of-Package Characterization Parameter

ΨJT

Still Air

Per JEDEC JESD51-2

0 m/sec Airflow

1.0

°C/W

1 Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the

application to determine if they are similar to those assumed in these calculations.

ADCLK846/PCBZ Datasheet(PDF) 6 Page - Analog Devices

ADCLK846/PCBZ Datasheet(HTML) 6 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Datasheet Download

Link URL