TC2054/2055/2186

DS21663D-page 4

© 2009 Microchip Technology Inc.

TEMPERATURE CHARACTERISTICS

Thermal Regulation

ΔV

—0.04

—

V/W

Note 8

Thermal Shutdown Die

Temperature

—

160

—

°C

Output Noise

eN

—

600

—

nV /

√Hz

MAX

, F = 10 kHz

Response Time

(from Shutdown Mode)

—60

—

µs

SHDN Input

SHDN Input High Threshold

60

—

—

SHDN Input Low Threshold

——

15

ERROR OUTPUT

Voltage

1.0

—

—

V

Output Logic Low Voltage

—

—

400

mV

1 mA Flows to ERROR,

ERROR Threshold Voltage

—

—

V

See Figure 4-2

ERROR Positive Hysteresis

—50

—

mV

Note 10

—2

—

ms

Resistance from ERROR to

GND

—

126

—

Ω

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges:

Extended Temperature Range

-40

—

+125

°C

Operating Temperature Range

-40

—

+125

°C

Storage Temperature Range

-65

—

+150

°C

Thermal Package Resistances:

Thermal Resistance, 5L-SOT-23

θ

JA

—

255

—

°C/W

ELECTRICAL SPECIFICATIONS (CONTINUED)

BOLDFACE type specifications apply for junction temperature of -40°C to +125°C.

Parameter

Sym

Min

Typ

Max

Units

Conditions

Note

1:

2:

3:

4:

5:

6:

Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested

over a load range from 1.0 mA to the maximum specified output current. Changes in output voltage due to heating

effects are covered by the thermal regulation specification.

7:

Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal

value at a 1V differential.

8:

Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,

9:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem-

V

OUTMAX

V

OUTMIN

–

() 10

6

×

V

OUT

ΔT

×

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