5075 series

SEIKO NPC CORPORATION —2

SERIES CONFIGURATION

VERSION NAME

Operating

supply voltage

range [V]

PAD layout

Recommended

operating frequency

*1. The recommended operating frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscil-

lation frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so

the oscillation characteristics of components must be carefully evaluated.

*2. Versions in parentheses ( ) are under development.

2.25 to 3.63

Flip Chip Bonding

20 to 40

(5075A1)

(5075A2)

(5075A3)

(5075A4)

(5075A5)

40 to 55

(5075AJ)

(5075AK)

(5075AL)

(5075AM)

(5075AN)

Wire Bonding

20 to 40

5075B1

(5075B2)

(5075B3)

(5075B4)

(5075B5)

40 to 55

5075BJ

(5075BK)

(5075BL)

(5075BM)

(5075BN)

Device

Package

Version name

WF5075

××–4

Wafer form

CF5075

××–4

Chip form

WF5075

−4

Form WF: Wafer form

CF: Chip (Die) form

Oscillation frequency range, frequency divider function

Pad layout type A: for Flip Chip Bonding

B: for Wire Bonding