CPC1390

www.clare.com

5

R04

Manufacturing Information

Soldering

For proper assembly, the component must be

processed in accordance with the current revision

of IPC/JEDEC standard J-STD-020. Failure to

follow the recommended guidelines may cause

permanent damage to the device resulting in impaired

performance and/or a reduced lifetime expectancy.

Washing

Clare does not recommend ultrasonic cleaning or the

use of chlorinated solvents.

RoHS

2002/95/EC

Pb

MECHANICAL DIMENSIONS

4-Pin DIP (”G” Suffix)

PC Board Pattern (Top View)

Dimensions

mm

(inches)

PIN 1

6.350 ± 0.127

(0.250 ± 0.005)

4.572 ± 0.127

(0.180 ± 0.005)

0.991

(0.039)

9º (ALL)

3.30 ± 0.050

(0.130 ± 0.002)

0.254

(0.010)

9.144 ± 0.508

(0.360 ± 0.020)

7.620 ± 0.254

(0.300 ± 0.010)

7.620 ± 0.127

(0.300 ± 0.005)

2.540 ± 0.127

(0.100 ± 0.005)

6 - 0.800 DIA.

(6 - 0.031 DIA.)

6.350 ± 0.127

(0.250 ± 0.005)

9º (ALL)

0.457 ± 0.076

(0.018 ± 0.003)

2.540 ± 0.127

(0.100 ± 0.005)

3.175

(0.125)

0.508

(0.020)

1.651

(0.065)

4-Pin DIP “GV” Package

PC Board Pattern (Top View)

Dimensions

mm

(inches)

10.160 ± 0.127

(0.400 ± 0.005)

2.540 ± 0.127

(0.100 ± 0.005)

6 - 0.800 DIA.

(6 - 0.031 DIA.)

6.350 ± 0.127

(0.250 ± 0.005)

9º (ALL)

3.30 ± 0.050

(0.130 ± 0.002)

0.254

(0.010)

10.160 ± 0.508

(0.400 ± 0.020)

7.620 ± 0.254

(0.300 ± 0.010)

6.350 ± 0.050

(0.250 ± 0.002)

4.572 ± 0.050

(0.180 ± 0.002)

0.991

(0.039)

9º (ALL)

0.457 ± 0.076

(0.018 ± 0.003)

2.540 ± 0.050

(0.100 ± 0.002)

2.92

(0.115)

0.127

(0.005)

1.651

(0.065)

Pin 1