Data Sheet

7

Rev. 1.0, 2008-04-21

TLE4263-2ES

General Product Characteristics

4.2

Functional Range

Note: Within the functional range the IC operates as described in the circuit description. The electrical

characteristics are specified within the conditions given in the related electrical characteristics table.

4.3

Thermal Resistance

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Max.

4.2.1

Input Voltage

V

I

5.5

45

V

–

4.2.2

Junction Temperature

T

j

-40

150

°C–

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Typ.

Max.

4.3.1

1) Not subject to production test, specified by design.

R

thJC

–

10

–

K/W

measured to

exposed pad

4.3.2

Junction to Ambient1)

R

thJA

–45

–

K/W

2)

2) Specified

R

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).

Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.

4.3.3

R

thJA

–

153

–

K/W

footprint only3)

4.3.4

R

thJA

–

64

–

K/W

300 mm² heatsink

3) Specified

R

(Chip+Package) was simulated on a 76.2

4.3.5

R

thJA

–

55

–

K/W

600 mm² heatsink

area3)