Layout and Grounding

Due to high current levels and fast switching wave-

forms, proper PC board layout is essential. High-cur-

rent ground paths should be connected in a star

configuration to PGND. These traces should be wide to

reduce resistance and as short as possible to reduce

stray inductance. All low-current ground paths should

be connected to GND. Place the input bypass capaci-

tor as close as possible to IN. See the MAX1640 EV kit

for layout example.

Adjustable-Output, Switch-Mode

Current Source with Synchronous Rectifier

______________________________________________________________________________________

11

___________________Chip Information

PROCESS: BiCMOS

Package Information

(For the latest package outline information and land patterns,

go to www.maxim-ic.com/packages. Note that a "+", "#", or "-" in

the package code indicates RoHS status only. Package draw-

ings may show a different suffix character, but the drawing per-

tains to the package regardless of RoHS status.package

drawing(s) in this data sheet may not reflect the most current

specifications. For the latest package outline information, go to

www.maxim-ic.com/packages.)

PACKAGE TYPE

PACKAGE CODE

DOCUMENT NO.

16 QSOP

E16+1

21-0055