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PAS302BCW-22S Datasheet(PDF) 13 Page - Pixart Imaging Inc. |
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PAS302BCW-22S Datasheet(HTML) 13 Page - Pixart Imaging Inc. |
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13 / 15 page ![]() PAS302BCW-22S CMOS Image Sensor IC Version 2.4, 20 Sep. 2005 PixArt Imaging Inc. E-mail: fae_service@pixart.com.tw 13 8. Package Specification Dimensions Symbol Min. Typ. Max. Unit Package Body Dimension X A 4310 4335 4360 µm Package Body Dimension Y B 4130 4155 4180 µm Package Height C 740 800 860 µm Ball Height C1 130 160 190 µm Package Body Thickness C2 605 640 675 µm Thickness of Glass surface to wafer C3 395 415 435 µm Ball Diameter D 270 300 330 µm Pin Pitch X axis J1 - 800 - µm Pin Pitch Y axis J2 - 800 - µm Edge to Pin Center Distance along X S1 537.5 567.5 597.5 µm Edge to Pin Center Distance along Y S2 447.5 477.5 507.5 µm |
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