ADV3219ACPZ-R7 datasheet(5/20 Pages) AD

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ADV3219/ADV3220

Rev. 0 | Page 5 of 20

ABSOLUTE MAXIMUM RATINGS

POWER DISSIPATION

Table 3.

Parameter

Rating

Supply Voltage (V+ − V−)

12 V

Analog Input Voltage

V− to V+

Digital Input Voltage

0 to V+

Output Voltage (Disabled Output)

(V+ − 1 V) to (V− + 1 V)

Output Short-Circuit

Duration

Momentary

Current

50 mA

Temperature

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +85°C

Junction Temperature

150°C

The ADV3219/ADV3220 are operated with ±5 V supplies and

can drive loads down to 150 Ω, resulting in a wide range of

possible power dissipations. For this reason, extra care must

be taken derating the operating conditions based on ambient

temperature.

Packaged in an 8-lead LFCSP, the ADV3219 and ADV3220

junction-to-ambient thermal impedance (θJA) is 85°C/W. For long-

term reliability, the maximum allowed junction temperature of the

die, TJ, should not exceed 125°C. Temporarily exceeding this

limit can cause a shift in parametric performance due to a change

in stresses exerted on the die by the package. Figure 2 shows the

range of the allowed internal die power dissipations that meet

these conditions over the −40°C to +85°C ambient temperature

range. When using Figure 2, do not include the external load

power in the maximum power calculation, but do include the

load current through the die output transistors.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

1.5

0.3

0.6

0.9

1.2

AMBIENT TEMPERATURE (°C)

TJ = 125°C

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

θJA

θJC

Unit

8-Lead LFCSP

°C/W

Figure 2. Maximum Die Power Dissipation vs. Ambient Temperature

ESD CAUTION

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