ADV3219ACPZ-R7 datasheet(18/20 Pages) AD

18 / 20 page

ADV3219/ADV3220

Rev. 0 | Page 18 of 20

OUTLINE DIMENSIONS

2.54

2.44

2.34

TOP VIEW

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.80

1.70

1.60

0.203 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

PIN 1

INDICATOR

(R 0.15)

FORPROPERCONNECTIONOF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-229-WEED

Figure 57. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]

3 mm × 3 mm Body, Very Very Thin, Dual Lead

(CP-8-11)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Branding Code

ADV3219ACPZ

−40°C to +85°C

8-Lead LFCSP_WD

CP-8-11

F0H

ADV3219ACPZ-RL

−40°C to +85°C

8-Lead LFCSP_WD, 13”Tape and Reel

CP-8-11

F0H

ADV3219ACPZ-R7

−40°C to +85°C

8-Lead LFCSP_WD, 7”Tape and Reel

CP-8-11

F0H

ADV3220ACPZ

−40°C to +85°C

8-Lead LFCSP_WD

CP-8-11

F0J

ADV3220ACPZ-RL

−40°C to +85°C

8-Lead LFCSP_WD, 13”Tape and Reel

CP-8-11

F0J

ADV3220ACPZ-R7

−40°C to +85°C

8-Lead LFCSP_WD, 7”Tape and Reel

CP-8-11

F0J

ADV3219-EVALZ

Evaluation Board

ADV3220-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.

ADV3219ACPZ-R7 Datasheet(PDF) 18 Page - Analog Devices

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