10HSI-S008-R0-C datasheet(15/71 Pages) HIROSE

Part #	10HSI-S008-R0-C

Description	IT3 Mezzanine Connector (32mm)

PDF	71 Pages

Scroll/Zoom	100%

Manufacturer	HIROSE [Hirose Electric]

Direct Link	http://www.hirose-connectors.com

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15 / 71 page

Signal Integrity Report – IT3 (32mm)

Page 15

Figure 22 Power Sum of FEXT for pair 4 of connector only for 50% pin density configuration

Figure 23 ICR profile of FEXT for pair 4 of connector only for 50% pin density configuration

3.1.2 S parameters (vias only)

The electrical performance of the via depends on the connector’s footprint and PCB stackup.

The PCB stackup is usually customer-specific. An example is given in Figure 24. The stackup

consists of 30 layers, totaling 121.78mil in thickness. To have ~100 Ohms differential impedance,

the signal line width and spacing are set to 3.5 mil and 7.5 mil, respectively, with

εr=3.80 and

tan

δ=0.01.

The via models used in this document are extracted from the demo board. In this document, we

consider the connector to be mounted from the top layer 1. Thus, a large layer number corresponds

10HSI-S008-R0-C Datasheet(PDF) 15 Page - Hirose Electric