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P89LPC970FDH Datasheet(PDF) 59 Page - NXP Semiconductors |
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P89LPC970FDH Datasheet(HTML) 59 Page - NXP Semiconductors |
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59 / 66 page ![]() P89LPC97X_2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 — 27 April 2010 59 of 66 NXP Semiconductors P89LPC970/971/972 8-bit microcontroller with accelerated two-clock 80C51 core 12. Package outline Fig 24. TSSOP20 package outline (SOT360-1) UNIT A1 A2 A3 bp cD (1) E (2) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.5 0.2 8 0 o o 0.13 0.1 0.2 1 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT360-1 MO-153 99-12-27 03-02-19 w M b p D Z e 0.25 110 20 11 pin 1 index θ A A1 A2 L p Q detail X L (A ) 3 HE E c v M A X A y 0 2.5 5 mm scale TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 A max. 1.1 |
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