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TPCF8B01 Datasheet(PDF) 3 Page - Toshiba Semiconductor

Part # TPCF8B01
Description  Notebook PC Applications Portable Equipment Applications
PDF  9 Pages
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TPCF8B01 Datasheet(HTML) 3 Page - Toshiba Semiconductor

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TPCF8B01
2009-09-29
3
Electrical Characteristics (Ta = 25°C)
MOSFET
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Gate leakage current
IGSS
VGS = ±8 V, VDS = 0 V
⎯
⎯
±10
μA
Drain cut-off current
IDSS
VDS = -20 V, VGS = 0 V
⎯
⎯
-10
μA
V (BR) DSS
ID = -10 mA, VGS = 0 V
-20
⎯
⎯
Drain-source breakdown voltage
V (BR) DSX
ID = -10 mA, VGS = 8V
-12
⎯
⎯
V
Gate threshold voltage
Vth
VDS = -10 V, ID = -200 μA
-0.5
⎯
-1.2
V
RDS (ON)
VGS = -1.8 V, ID = -0.7 A
⎯
215
300
RDS (ON)
VGS = -2.5 V, ID = -1.4A
⎯
110
160
Drain-source ON resistance
RDS (ON)
VGS = -4.5 V, ID = -1.4 A
⎯
72
110
m
Ω
Forward transfer admittance
|Yfs|
VDS = -10 V, ID = -1.4 A
2.4
4.7
⎯
S
Input capacitance
Ciss
⎯
470
⎯
Reverse transfer capacitance
Crss
⎯
70
⎯
Output capacitance
Coss
VDS = -10 V, VGS = 0 V, f = 1 MHz
⎯
80
⎯
pF
Rise time
tr
⎯
5
⎯
Turn-on time
ton
⎯
9
⎯
Fall time
tf
⎯
8
⎯
Switching time
Turn-off time
toff
Duty
≤ 1%, tw = 10 μs
⎯
26
⎯
ns
Total gate charge
(gate-source plus gate-drain)
Qg
⎯
6
⎯
Gate-source charge
Qgs
⎯
4
⎯
Gate-drain (“miller”) charge
Qgd
VDD ∼− -16 V, VGS = -5 V,
ID = -2.7 A
⎯
2
⎯
nC
MOSFET Source-Drain Ratings and Characteristics
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Drain reverse current
Pulse (Note 1)
IDRP
⎯
⎯
⎯
-10.8
A
Forward voltage (diode)
VDSF
IDR = -2.7 A, VGS = 0 V
⎯
⎯
-1.2
V
SBD
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
VFM(1)
IFM = 0.7 A
⎯
0.43
⎯
V
Peak forward voltage
VFM(2)
IFM = 1.0 A
⎯
0.46
0.49
V
Repetitive peak reverse current
IRRM
VRRM = 20 V
⎯
⎯
50
μA
Junction capacitance
Cj
VR = 10 V, f = 1 MHz
⎯
54
⎯
pF
VDD ∼− -10 V
-5 V
VGS
0 V
ID = -1.4 A
VOUT



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