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SMP402SC Datasheet(PDF) 12 Page - Power Integrations, Inc. |
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SMP402SC Datasheet(HTML) 12 Page - Power Integrations, Inc. |
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12 / 16 page ![]() SMP402 D 1/96 12 10 10 10 10 1 10 100 1000 -1 -2 -3 0.1 1 10 100 -4 Time (s) TRANSIENT THERMAL IMPEDANCE 8 6 0 0 25 50 75 100 125 4 Case Temperature ( °C) PACKAGE POWER DERATING 2 Tj = 120°C PI-1846-050196 16 1 A L C DIM inches mm A .398-.413 10.10-10.50 B .050 BSC 1.27 BSC C .014-.018 0.36-0.46 E .093-.104 2.35-2.65 F .004-.012 0.10-0.30 J .394-.418 10.01-10.62 L .009-.012 0.23-0.32 M .020-.040 0.51-1.02 N .291-.299 7.40-7.60 9 8 B E F J 0-8˚ TYP. M N Notes: 1. Package dimensions conform to JEDEC specification MS-013-AA for standard small outline (SO) package, 16 leads, 7.50 mm (.300 inch) body width (issue A, June 1985). 2. Controlling dimensions are in mm. 3. Dimensions are for the molded body and do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .15 mm (.006 inch) on any side. 4. Pin 1 side identified by chamfer on top edge of the package body or indent on Pin 1 end. (3) (3) S16A Plastic SO-16 (W) |
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