IP4359CX4

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© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 1 — 6 August 2010

7 of 12

NXP Semiconductors

IP4359CX4

Dual channel low capacitance ESD protection

8.

Design and assembly recommendations

8.1 PCB design guidelines

For optimum performance it is recommended to use a Non-Solder Mask Defined (NSMD),

also known as a copper-defined design, incorporating laser-drilled micro-vias connecting

the ground pads to a buried ground-plane layer. This results in the lowest possible ground

inductance and provides the best high frequency and ESD performance. For this case,

refer to Table 7 for the recommended PCB design parameters.

8.2 PCB assembly guidelines for Pb-free soldering

Table 6.

Dimensions of IP4359CX4/LF-H500 for Figure 5

Symbol

Min

Typ

Max

Unit

A

0.41

0.45

0.49

mm

0.18

0.20

0.22

mm

0.23

0.25

0.27

mm

b

0.21

0.26

0.31

mm

D

0.71

0.76

0.81

mm

E

0.71

0.76

0.81

mm

e

-

0.4

-

mm

Table 7.

Recommended PCB design parameters

Parameter

Value or specification

PCB pad diameter

250

μm

Micro-via diameter

100

μm (0.004 inch)

Solder mask aperture diameter

325

μm

Copper thickness

20

μm to 40 μm

Copper finish

AuNi or OSP

PCB material

FR4

Table 8.

Assembly recommendations

Parameter

Value or specification

Solder screen aperture diameter

290

μm

Solder screen thickness

100

μm (0.004 inch)

Solder paste: Pb-free

SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %)

Solder / flux ratio

50 / 50

Solder reflow profile

see Figure 6