IP4359CX4

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 1 — 6 August 2010

8 of 12

NXP Semiconductors

IP4359CX4

Dual channel low capacitance ESD protection

The device is capable of withstanding at least three reflows of this profile.

Fig 6.

Pb-free solder reflow profile

Table 9.

Characteristics

Symbol

Parameter

Conditions

Min Typ Max Unit

peak reflow temperature

230

-

260

°C

time 1

soak time

60

-

180

s

time 2

time during T

≥ 250 °C

-

-

30

s

time 3

time during T

≥ 230 °C

10

-

50

s

time 4

time during T > 217

°C

30

-

150

s

time 5

-

-

540

s

dT/dt

rate of change of temperature

cooling rate

-

-

−6

°C/s

pre-heat

2.5

-

4.0

°C/s

001aai943

250

230

217

T

(

°C)

cooling rate

pre-heat

t (s)