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KM416RD8ACD-RK80 Datasheet(PDF) 61 Page - Samsung semiconductor |
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KM416RD8ACD-RK80 Datasheet(HTML) 61 Page - Samsung semiconductor |
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61 / 64 page ![]() Page 58 KM416RD8AC(D)/KM418RD8AC(D) Direct RDRAM™ Rev. 1.01 Oct. 1999 Center-Bonded uBGA Package Figure 61 shows the form and dimensions of the recom- mended package for the center-bonded CSP device class. Figure 61: Center-Bonded uBGA Package Table 27 lists the numerical values corresponding to dimen- sions shown in Figure 61. Table 27: Center-Bonded uBGA Package Dimensions A B C D E F G H J 1 2 3 4 5 6 7 D A e1 d E E1 8 e2 Top Bottom Top Bottom 9 10 11 12 Symbol Parameter Min(128Mb/144Mb) Max(128Mb/144Mb) Unit e1 Ball pitch (x-axis) 1.00 1.00 mm e2 Ball pitch (y-axis) 0.80 0.80 mm A Package body length 11.90 12.10 mm D Package body width 10.10 10.30 mm E Package total thickness - 1.00a mm E1 Ball height 0.20 0.30 mm d Ball diameter 0.30 0.40 mm a. The E,MAX parameter for SO-RIMM applications is 0.94mm. |
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