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B32676G1905 Datasheet(PDF) 13 Page - EPCOS |
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B32676G1905 Datasheet(HTML) 13 Page - EPCOS |
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13 / 32 page ![]() Immersion depth 2.0 +0/ 0.5 mm from capacitor body or seating plane Shield Heat-absorbing board, (1.5 ±0.5) mm thick, between capacitor body and liquid solder Evaluation criteria: Visual inspection No visible damage ∆C/C 0 2% for MKT/MKP/MFP 5% for EMI suppression capacitors tan δ As specified in sectional specification B32674 ... B32678 MKP DC link high power series Page 13 of 32 Please read Cautions and warnings and Important notes at the end of this document. |
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