Datasheet TLE 6214 L

V3.0

Page

18.10.2004

2

Pin Description

Pin Configuration (Top view)

Pin

Symbol

Function

1

IN2

Input Channel 2

2

SI

SPI Signal In

3

OUT2

Power Output Channel 2

4

CO1

Current Sense 1/2 / Fault /

Status Ch1

5

SCLK

SPI Clock

6

GND

Ground

7

IN1

Input Channel 1

8

CS

SPI Chip Select

9

OUT1

Power Output Channel 1

10

VS

Supply Voltage

11

CO2

SPI Signal Out / Status Ch2

12

GND

Ground

Parameter

Symbol

Values

Unit

Supply Voltage

-0.3 ... +7

V

Continuous Drain Source Voltage (OUT1...OUT2)

-0.3 ... +48

V

Input Voltage, All Inputs and Data outputs, Sense Lines

- 0.3 ... + 7

V

A

Reverse Current per channel

-3

A

Output Clamping Energy (single event); linear decreasing

current

75

mJ

Current Limit 2, slew rate 1 (default setting)

Current Limit 2, slew rate 2

Current Limit 1, slew rate 1 / 2

48

32

18

V

Electrostatic Discharge Voltage (human body model)

according to EIA/JESD22-A114-E

Output Pins

All other Pins

4000

2000

V

V

DIN Humidity Category, DIN 40 040

E

IEC Climatic Category, DIN IEC 68-1

40/150/56

1

) Output current rating as long as maximum junction temperature is not exceeded. The maximum output current has to be calculated using

2

Device mounted on PCB (50mm x 50mm x 1,5mm epoxy, FR4) with 6cm2 copper heatsink area (one layer, 70µm thick); PCB in test cham-

ber with blown air

IN 2

1

•

12

GND

SI

2

11

CO 2

OUT2

3

10

Vs

CO 1

4

9

OUT1

SCLK

5

8

CS

GND

6

7

IN 1

Power P-DSO -12

Both GND pins and heat sink must be

connected to GND externally.