K53P144M100SF2 datasheet(21/80 Pages) FREESCALE

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4. 15pF load

5.3 Thermal specifications

5.3.1 Thermal operating requirements

Table 9. Thermal operating requirements

Symbol

Description

Min.

Max.

Unit

Die junction temperature

–40

125

°C

Ambient temperature

–40

°C

5.3.2 Thermal attributes

Board

type

Symbol

Description

144

LQFP

144

MAPBGA

Unit

Notes

Single-

layer (1s)

RθJA

Thermal resistance, junction to ambient (natural

convection)

°C/W

Four-layer

(2s2p)

RθJA

Thermal resistance, junction to ambient (natural

convection)

°C/W

Single-

layer (1s)

RθJMA

Thermal resistance, junction to ambient (200 ft./

min. air speed)

°C/W

Four-layer

(2s2p)

RθJMA

Thermal resistance, junction to ambient (200 ft./

min. air speed)

°C/W

—

RθJB

Thermal resistance, junction to board

°C/W

—

RθJC

Thermal resistance, junction to case

°C/W

—

ΨJT

Thermal characterization parameter, junction to

package top outside center (natural convection)

°C/W

Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental

Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method

Environmental Conditions—Forced Convection (Moving Air).

6 Peripheral operating requirements and behaviors

All digital I/O switching characteristics assume:

1. output pins

• have CL=30pF loads,

• are configured for fast slew rate (PORTx_PCRn[SRE]=0), and

• are configured for high drive strength (PORTx_PCRn[DSE]=1)

Peripheral operating requirements and behaviors

K53 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.

Freescale Semiconductor, Inc.

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