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33874 Datasheet(PDF) 11 Page - Freescale Semiconductor, Inc |
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33874 Datasheet(HTML) 11 Page - Freescale Semiconductor, Inc |
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11 / 38 page ![]() Analog Integrated Circuit Device Data Freescale Semiconductor 11 33874 ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS POWER OUTPUT TIMING (HS0, HS1, HS2, HS3) (continued) Over-current High Detection Blanking Time tOCH 1.0 5.0 20 μs CS to CSNS Valid Time(24) tCNSVAL – – 10 μs Watchdog Timeout(25) WD[1:0] : 00 WD[1:0] : 01 WD[1:0] : 10 WD[1:0] : 11 tWDTO0 tWDTO1 tWDTO2 tWDTO3 446 223 1800 900 558 279 2250 1125 725 363 2925 1463 ms Direct Input Switching Frequency (DICR D3 = 0) fPWM - 300 - Hz SPI INTERFACE CHARACTERISTICS (RST, CS, SCLK, SI, SO) Maximum Frequency of SPI Operation fSPI – – 3.0 MHz Required Low-state Duration for RST(26) tWRST – 50 350 ns Rising Edge of CS to Falling Edge of CS (Required Setup Time)(27) tCS – – 300 ns Rising Edge of RST to Falling Edge of CS (Required Setup Time)(27) tENBL – – 5.0 μs Falling Edge of CS to Rising Edge of SCLK (Required Setup Time)(27) tLEAD – 50 167 ns Required High-state Duration of SCLK (Required Setup Time)(27) tWSCLKh – – 167 ns Required Low-state Duration of SCLK (Required Setup Time)(27) tWSCLKl – – 167 ns Falling Edge of SCLK to Rising Edge of CS (Required Setup Time)(27) tLAG – 50 167 ns SI to Falling Edge of SCLK (Required Setup Time)(28) tSI(SU) – 25 83 ns Falling Edge of SCLK to SI (Required Setup Time)(28) tSI(HOLD) – 25 83 ns SO Rise Time CL = 200pF tRSO – 25 50 ns SO Fall Time CL = 200pF tFSO – 25 50 ns SI, CS, SCLK, Incoming Signal Rise Time(28) tRSI – – 50 ns SI, CS, SCLK, Incoming Signal Fall Time(28) tFSI – – 50 ns Time from Falling Edge of CS to SO Low-impedance(29) tSO(EN) – – 145 ns Time from Rising Edge of CS to SO High-impedance(30) tSO(DIS) – 65 145 ns Time from Rising Edge of SCLK to SO Data Valid(31) 0.2 VDD ≤ SO ≤ 0.8 x VDD, CL = 200pF tVALID – 65 105 ns Notes 24. Time necessary for the CSNS to be with ±5% of the targeted value. 25. Watchdog timeout delay measured from the rising edge of WAKE or RST from a sleep state condition, to output turn-ON with the output driven OFF and FSI floating. The values shown are for WDR setting of [00]. The accuracy of tWDTO is consistent for all configured watchdog timeouts. 26. RST low duration measured with outputs enabled and going to OFF or disabled condition. 27. Maximum setup time required for the 33874 is the minimum guaranteed time needed from the microcontroller. 28. Rise and Fall time of incoming SI, CS, and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing. 29. Time required for output status data to be available for use at SO. 1.0k Ω on pull-up on CS. 30. Time required for output status data to be terminated at SO. 1.0k Ω on pull-up on CS. 31. Time required to obtain valid data out from SO following the rise of SCLK. Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ VPWR ≤ 27V, 4.5V ≤ VDD ≤ 5.5V, -40°C ≤ TA ≤ 125°C, GND = 0V, unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit |
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