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CMM4000 Datasheet(PDF) 7 Page - Mimix Broadband

Part # CMM4000
Description  2.0-18.0 GHz GaAs MMIC
PDF  9 Pages
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Manufacturer  MIMIX [Mimix Broadband]
Direct Link  http://www.mimixbroadband.com
Logo MIMIX - Mimix Broadband

CMM4000 Datasheet(HTML) 7 Page - Mimix Broadband

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App Note [1] Biasing - As shown in the bonding diagram, this device
operates using a self-biased architecture and only requires one drain bias.
Bias is nominally Vd=5V, I=115mA. Additionally there are three source
resistors on chip, 13, 12 and 8.5 Ohms. One of these must be bonded to
ground. Typically 12 Ohms is bonded to ground to achieve performance as
shown. Bonding to one of the other resistors or any or all in parallel may
allow additional performance adjustment.
App Note [2] Bias Arrangement - Each DC pad (Vd) needs to have DC
bypass capacitance (~100-200 pF) as close to the device as possible.
Additional DC bypass capacitance (~0.01 uF) is also recommended.
Current Select - At times the need to balance performance against system
power budgets forces a trade off between bias current, gain, P1dB, or other
parameters. This note includes information on how to use the built-in binary
bias ladder to adjust the currents enabling this trade off. The bias is controlled
by the self bias resistor network in the bottom right corner of the die. These
resistors have binary relative values so that you can step the current from a
minimum to a maximum with multiple different bias options available along
the way. The infinity option is not useful as there is no current flow with all
resistors open. Using the information from the current select table shown
here allows the user to set the resistors adjusting the current up or down
from a nominal value. In addition, the table can be used to estimate how to
make a change with minimum trial and error. The net result is that the current
can be adjusted over a wide range with incremental control.
Bonding Substrate - If you are concerned about dialing in the exact current
or making fine adjustments to the bias point it is recommended that a
bonding substrate, like the one shown here, be used. The purpose is to allow
the chip to substrate wire bonds to be left intact and not to be used for
adjustments. The bond wires that go from the substrate to ground are then
added or subtracted to tune the bias as necessary.
CMM4000-BD
2.0-18.0 GHz GaAs MMIC
Buffer Amplifier
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
©2009 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
September 2009 - Rev 21-Sep-09
Left
Center
Corner
Delta Current
13
12
8.5
mA
0
0
0
Infinity
NA
1
0
0
13.00
-140
0
1
0
12.00
-130
110
6.24
-80
001
8.50
-55
101
5.14
-30
011
4.98
-25
111
3.60
Max
Net R
CMM4000 - Source Resistance Table



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