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PCF8531U2DA Datasheet(PDF) 33 Page - NXP Semiconductors |
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PCF8531U2DA Datasheet(HTML) 33 Page - NXP Semiconductors |
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33 / 51 page ![]() PCF8531 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 6 — 16 May 2011 33 of 51 NXP Semiconductors PCF8531 34 x 128 pixel matrix driver 12. Limiting values [1] Parameters are valid over the whole operating temperature range unless otherwise specified. All voltages are referenced to VSS unless otherwise specified. [2] Pass level; Human Body Model (HBM), according to Ref. 6 “JESD22-A114”. [3] Pass level; Machine Model (MM), according to Ref. 7 “JESD22-A115”. [4] Pass level; latch-up testing according to Ref. 8 “JESD78” at maximum ambient temperature (Tamb(max)). [5] According to the NXP store and transport requirements (see Ref. 10 “NX3-00092”) the devices have to be stored at a temperature of +8 °C to +45 °C and a humidity of 25 % to 75 %. For long term storage products deviant conditions are described in that document. Table 14. Limiting values [1] In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDD1 supply voltage 1 logic supply −0.5 +5.5 V VDD2 supply voltage 2 multiplier supply −0.5 +4.5 V VDD3 supply voltage 3 multiplier supply −0.5 +4.5 V VLCD LCD supply voltage −0.5 +9.0 V VI input voltage −0.5 V DD + 0.5 V VO output voltage −0.5 V DD + 0.5 V IDD(LCD) LCD supply current −50 +50 mA ISS ground supply current −50 +50 mA II input current −10 +10 mA IO output current −10 +10 mA Ptot total power dissipation - 300 mW P/out power dissipation per output - 30 mW VESD electrostatic discharge voltage HBM [2] - ±1500 V MM [3] - ±200 V Ilu latch-up current [4] -200 mA Tj junction temperature - +150 °C Tstg storage temperature [5] −65 +150 °C Tamb ambient temperature operating device −40 +85 °C |
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