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PCF8531U2DA Datasheet(PDF) 33 Page - NXP Semiconductors

Part # PCF8531U2DA
Description  34 x 128 pixel matrix driver Single-chip LCD controller and driver
PDF  51 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCF8531U2DA Datasheet(HTML) 33 Page - NXP Semiconductors

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PCF8531
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 6 — 16 May 2011
33 of 51
NXP Semiconductors
PCF8531
34 x 128 pixel matrix driver
12. Limiting values
[1]
Parameters are valid over the whole operating temperature range unless otherwise specified. All voltages
are referenced to VSS unless otherwise specified.
[2]
Pass level; Human Body Model (HBM), according to Ref. 6 “JESD22-A114”.
[3]
Pass level; Machine Model (MM), according to Ref. 7 “JESD22-A115”.
[4]
Pass level; latch-up testing according to Ref. 8 “JESD78” at maximum ambient temperature (Tamb(max)).
[5]
According to the NXP store and transport requirements (see Ref. 10 “NX3-00092”) the devices have to be
stored at a temperature of +8
°C to +45 °C and a humidity of 25 % to 75 %. For long term storage products
deviant conditions are described in that document.
Table 14.
Limiting values [1]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDD1
supply voltage 1
logic supply
−0.5 +5.5
V
VDD2
supply voltage 2
multiplier supply
−0.5 +4.5
V
VDD3
supply voltage 3
multiplier supply
−0.5 +4.5
V
VLCD
LCD supply voltage
−0.5 +9.0
V
VI
input voltage
−0.5 V
DD + 0.5
V
VO
output voltage
−0.5 V
DD + 0.5
V
IDD(LCD)
LCD supply current
−50
+50
mA
ISS
ground supply current
−50
+50
mA
II
input current
−10
+10
mA
IO
output current
−10
+10
mA
Ptot
total power dissipation
-
300
mW
P/out
power dissipation per output
-
30
mW
VESD
electrostatic discharge voltage
HBM
[2]
-
±1500
V
MM
[3]
-
±200
V
Ilu
latch-up current
[4]
-200
mA
Tj
junction temperature
-
+150
°C
Tstg
storage temperature
[5]
−65
+150
°C
Tamb
ambient temperature
operating device
−40
+85
°C



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