ADP2127 datasheet(5/20 Pages) AD

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ADP2126/ADP2127

Rev. A | Page 5 of 20

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VIN to GND

−0.3 V to +6 V

EXTCLK to GND

−0.3 V to +6 V

SW, MODE to GND

−0.3 V to VIN

FB to GND

−0.3 V to +3.6 V

Operating Ambient Temperature (TA)

–40°C to +85°C1

Operating Junction Temperature (TJ)

at ILOAD = 500 mA

–40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

1 The maximum operating junction temperature (TJ (MAX)) supersedes the

maximum operating ambient temperature (TA (MAX)). See the Thermal

Considerations section for more information.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination.

THERMAL CONSIDERATIONS

The maximum operating junction temperature (TJ (MAX))

supersedes the maximum operating ambient temperature

(TA (MAX)) because the ADP2126/ADP2127 may be damaged

when the junction temperature limits are exceeded. Monitoring

ambient temperature does not guarantee that TJ is within the

specified temperature limits.

In applications with high power dissipation and poor PCB

thermal resistance, the maximum ambient temperature may

need to be derated. In applications with moderate power

dissipation and good PCB thermal resistance, the maximum

ambient temperature can exceed the maximum limit as long as

the junction temperature is within specification limits.

The operating junction temperature (TJ) of the device is dependent

on the ambient temperature (TA), the power dissipation of the

device (PD), and the junction-to-ambient thermal resistance of

the package (θJA). TJ is calculated using the following formula:

TJ = TA + (PD × θJA)

(1)

See the Applications Information section for further information

on calculating the operating junction temperature for a specific

application.

THERMAL RESISTANCE

θJA of the package is based on modeling and calculation using a

4-layer board. θJA is highly dependent on the application and

board layout. In applications where high maximum power

dissipation exists, attention to thermal board design is required.

The value of θJA may vary, depending on PCB material, layout,

and environmental conditions.

θJA is specified for worst-case conditions, that is, a device soldered

on a circuit board for surface-mount packages. θJA is determined

according to JEDEC Standard JESD51-9 on a 4-layer printed

circuit board (PCB).

Table 3. Thermal Resistance (4-Layer PCB)

Package Type

θJA

Unit

6-Ball Bumped Bare Die Sales

105

°C/W

6-Pad Embedded Wafer Level Package

105

°C/W

ESD CAUTION

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