L6226Q datasheet(24/29 Pages) STMICROELECTRONICS

Part #	L6226Q

Description	DMOS dual full bridge driver

PDF	29 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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24 / 29 page

Thermal management

L6226Q

24/29

Doc ID 14335 Rev 5

Thermal management

In most applications the power dissipation in the IC is the main factor that sets the maximum

current that can be deliver by the device in a safe operating condition. Therefore, it has to be

taken into account very carefully. Besides the available space on the PCB, the right package

should be chosen considering the power dissipation. Heat sinking can be achieved using

copper on the PCB with proper area and thickness. For instance, using a VFQFPN32L 5x5

package the typical Rth(JA) is about 42 °C/W when mounted on a double-layer FR4 PCB with

a dissipating copper surface of 0.5 cm2 on the top side plus 6 cm2 ground layer connected

through 18 via holes (9 below the IC).

L6226Q Datasheet(PDF) 24 Page - STMicroelectronics