Technical Note

15/17

LM358DT/PT/ST/WDT/WPT,LM2904DT/PT/ST/WDT/WPT

LM324DT/PT/WDT,LM2902DT/PT/WDT

www.rohm.com

2011.06 - Rev.B

© 2011 ROHM Co., Ltd. All rights reserved.

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Derating curves

Power Dissipation

Power Dissipation

Package

Pd[W]

θ

ja [℃/W]

Package

Pd[W]

θ

ja [℃/W]

SO package8 (*8)

450

3.6

SO package14

610

4.9

TSSOP8 (*6)

500

4.0

TSSOP14

870

7.0

Mini SO8 (*7)

470

3.76

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Precautions

1) Unused circuits

When there are unused circuits, it is recommended that they be connected as in Fig.103, setting

the non-inverting input terminal to a potential within the in-phase input voltage range (VICM).

2) Input terminal voltage

Applying Vcc

characteristics or destruction, irrespective of

the supply voltage. However, this does not ensure normal circuit operation. Please note that the

circuit operates normally only when the input voltage is

within the common mode input voltage range of the electric characteristics.

3) Power supply (single / dual)

The op-amp operates when the voltage supplied is between Vcc

Therefore, the single supply op-mp can be used as a dual supply op-amp as well.

4) Power dissipation (Pd)

Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to the rise in chip temperature, including

reduced current capability. Therefore, please take into consideration the power dissipation (Pd) under actual operating conditions and apply a sufficient

margin in thermal design. Refer to the thermal derating curves for more information.

5) Short-circuit between pins and erroneous mounting

Incorrect mounting may damage the IC. In addition, the presence of foreign substances between the outputs, the output and the power supply, or the output

and Vcc

6) Operation in a strong electromagnetic field

Operation in a strong electromagnetic field may cause malfunctions.

7) Radiation

This IC is not designed to withstand radiation.

8) IC handing

Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuation of the electrical characteristics due to piezoelectric (piezo)

effects.

9) IC operation

The output stage of the IC is configured using Class C push-pull circuits. Therefore, when the load resistor is connected to the middle potential of Vcc

Vcc

terminal and Vcc

10) Board inspection

Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every process is recommended. In addition,

when attaching and detaching the jig during the inspection phase, ensure that the power is turned OFF before inspection and removal. Furthermore, please

take measures against ESD in the assembly process as well as during transportation and storage.

11) Output capacitor

Discharge of the external output capacitor to Vcc

circuitry due to thermal stress. Therefore, when using this IC in circuits where oscillation due to output capacitive load does not occur, such as in voltage

comparators, use an output capacitor with a capacitance less than 0.1μF.

0

200

400

600

800

1000

0

25

50

75

100

125

150

AMBIENT TEMPERATURE [℃]

0

200

400

600

800

0

25

50

75

100

125

150

AMBIENT TEMPERATURE [℃]

Fig.103 Disable circuit example

Fig.102 Derating Curves

connect

to Vicm

－

＋

LM358DR/PWR/DGKR

LM2904DR/PWR/DGKR/VQDR/VQPWR

LM324DR/PWR/KDR

LM2902DR/PWR/KDR/KPWR/KQDR/KQPWR

70

LM358ST

LM358DT

LM358WDT

LM2904PT

LM2904WPT

LM2904ST

LM2904DT

LM2904WDT

LM324PT

LM324DT

LM324WDT

LM2902ST

LM2902DT

LM2902WDT

70

LM358PT

LM358WPT