Data Sheet

ADV7181D

Rev. 0 | Page 21 of 24

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4

0.25 MIN

TOP VIEW

8.75

BSC SQ

9.00

BSC SQ

1

64

16

17

49

48

32

33

0.50

0.40

0.30

0.50

BSC

0.20 REF

12° MAX

0.80 MAX

0.65 TYP

1.00

0.85

0.80

7.50

REF

0.05 MAX

0.02 NOM

0.60 MAX

0.60

MAX

EXPOSED PAD

(BOTTOM VIEW)

SEATING

PLANE

PIN 1

INDICATOR

7.25

7.10 SQ

6.95

PIN 1

INDICATOR

0.30

0.23

0.18

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 10. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

9 mm × 9 mm Body, Very Thin Quad

(CP-64-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model1, 2

Temperature Range

Package Description

Package Option

ADV7181DBCPZ

−40°C to +85°C

64-Lead LFCSP

CP-64-3

ADV7181DBCPZ-RL

−40°C to +85°C

64-Lead LFCSP

CP-64-3

ADV7181DWBCPZ

−40°C to +85°C

64-Lead LFCSP

CP-64-3

ADV7181DWBCPZ-RL

−40°C to +85°C

64-Lead LFCSP

CP-64-3

EVAL-ADV7181DEBZ

Evaluation Board

AUTOMOTIVE PRODUCTS

The ADV7181DW models are available with controlled manufacturing to support the quality and reliability requirements of automotive

applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers

should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in

automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to

obtain the specific Automotive Reliability reports for these models.