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PACKAGE ORDERING INFORMATION

Pin Configurations

1

2

3

6

5

4

OUT

V–

IN+

V+

REF

IN–

SOT23-6

TLV3011AMDBV

1

2

3

6

5

4

OUT

V–

IN+

V+

REF

IN–

SOT23-6

TLV3012AMDBV

(1)

Note:Pin1isdeterminedbyorientingpackagemarkingasshown.

ProductPreview

(1)

TopView

ABSOLUTE MAXIMUM RATINGS

(1)

TLV3011-EP, TLV3012-EP

SGLS349 – OCTOBER 2006

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

ORDERABLE PART NUMBER

TOP SIDE MARKING

-55

°C TO 125°C

DBV-SOT

TLV3011AMDBVREP

BTV

DBV-SOT

TBD

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

Product Preview

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

7

V

–0.5

(V+) +0.5

V

Signal input terminals

±10

mA

Continous

Operating temperature range

–55

125

°C

Storage temperature range

–65

150

°C

Junction temperature

150

°C

Lead ambient temperature (soldering, 10 s)

300

°C

ESD rating (Human-Body Model)

2000

V

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to the network ground terminal.

(3)

Short circuit to ground

2

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