1

FEATURES

See mechanical drawings for dimensions.

NC – No internal connection

DRL PACKAGE

(TOP VIEW)

2

GND

Y

V

CC

6

5

1

NC

3

4

X1

X2

DESCRIPTION/ORDERING INFORMATION

SN74LVC1GX04-EP

CRYSTAL OSCILLATOR DRIVER

SGDS029 – SEPTEMBER 2007

www.ti.com

2

• Controlled Baseline

• Low Power Consumption, 10 μA Max I

CC

–

One Assembly

• ±24 mA Output Drive at 3.3 V

–

One Test Site

• I

Operation

–

One Fabrication Site

• Latch-Up Performance Exceeds 100 mA Per

• Enhanced Diminishing Manufacturing Sources

JESD 78, Class II

(DMS) Support

• ESD Protection Exceeds JESD 22

• Enhanced Product-Change Notification

–

2000-V Human-Body Model (A114-A)

–

200-V Machine Model (A115-A)

• Available in Texas Instruments NanoStar™

and NanoFree™ Packages

–

1000-V Charged-Device Model (C101)

• Supports 5-V V

• Inputs Accept Voltages to 5.5 V

• One Unbuffered Inverter (SN74LVC1GU04) and

One Buffered Inverter (SN74LVC1G04)

• Suitable for Commonly Used Clock

Frequencies:

–

15 kHz, 3.58 MHz, 4.43 MHz, 13 MHz,

25 MHz, 26 MHz, 27 MHz, 28 MHz

• Max t

(1)

Component qualification in accordance with JEDEC and

industry standards to ensure reliable operation over an

extended temperature range. This includes, but is not limited

to, Highly Accelerated Stress Test (HAST) or biased 85/85,

temperature cycle, autoclave or unbiased HAST,

electromigration, bond intermetallic life, and mold compound

life. Such qualification testing should not be viewed as

justifying use of this component beyond specified

performance and environmental limits.

SN74LVC1GU04 (inverter with unbuffered output) and the SN74LVC1G04 (inverter) functions into a single

device. The LVC1GX04 is optimized for use in crystal oscillator applications.

ORDERABLE PART NUMBER

–55

°C to 125°C SOT (SOT-553) – DRL

Reel of 4000

CLVC1GX04MDRLREP

CDD

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

DRL: The actual top-side marking has one additional character that designates the assembly/test site.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

NanoStar, NanoFree are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.