www.ti.com

FEATURES

DGG PACKAGE

(TOP VIEW)

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

1OE

1Y1

1Y2

GND

1Y3

1Y4

2Y1

2Y2

GND

2Y3

2Y4

3Y1

3Y2

GND

3Y3

3Y4

4Y1

4Y2

GND

4Y3

4Y4

4OE

2OE

1A1

1A2

GND

1A3

1A4

2A1

2A2

GND

2A3

2A4

3A1

3A2

GND

3A3

3A4

4A1

4A2

GND

4A3

4A4

3OE

DESCRIPTION/ORDERING INFORMATION

SN74LVC16244A-EP

16-BIT BUFFER/DRIVER

WITH 3-STATE OUTPUTS

SCAS740A – DECEMBER 2003 – REVISED JUNE 2005

•

Controlled Baseline

– One Assembly/Test Site, One Fabrication

Site

•

Enhanced Diminishing Manufacturing

Sources (DMS) Support

•

Enhanced Product-Change Notification

•

•

Member of the Texas Instruments Widebus™

Family

•

Operates From 1.65 V to 3.6 V

•

Inputs Accept Voltages to 5.5 V

•

Max t

•

Typical V

<0.8 V at V

•

Typical V

>2 V at V

•

I

Operation

•

Supports Mixed-Mode Signal Operation On All

Ports (5-V Input/Output Voltage With 3.3-V

V

•

Latch-Up Performance Exceeds 250 mA Per

JESD 17

•

ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)

– 1000-V Charged-Device Model (C101)

(1)

Component qualification in accordance with JEDEC and

industry standards to ensure reliable operation over an

extended temperature range. This includes, but is not limited

to, Highly Accelerated Stress Test (HAST) or biased 85/85,

temperature cycle, autoclave or unbiased HAST,

electromigration, bond intermetallic life, and mold compound

life. Such qualification testing should not be viewed as

justifying use of this component beyond specified

performance and environmental limits.

The SN74LVC16244A is designed specifically to improve the performance and density of 3-state memory

address drivers, clock drivers, and bus-oriented receivers and transmitters.

ORDERING INFORMATION

ORDERABLE PART NUMBER

TOP-SIDE MARKING

–40°C to 85°C

TSSOP – DGG

Tape and reel

CLVC16244AIDGGREP

C16244AEP

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Widebus is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2003–2005, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

On products compliant to MIL-PRF-38535, all parameters are

Instruments standard warranty. Production processing does not

tested unless otherwise noted. On all other products, production

necessarily include testing of all parameters.

processing does not necessarily include testing of all parameters.