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SN65LBC176AMDREP Datasheet(PDF) 3 Page - Texas Instruments

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Part # SN65LBC176AMDREP
Description  DIFFERENTIAL BUS TRANSCEIVER
PDF  17 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

SN65LBC176AMDREP Datasheet(HTML) 3 Page - Texas Instruments

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SN65LBC176AEP
DIFFERENTIAL BUS TRANSCEIVER
SGLS151C − DECEMBER 2002 − REVISED JULY 2004
3
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
absolute maximum ratings†
Supply voltage, VCC (see Note 1)
−0.3 V to 6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range at any bus terminal (A or B)
−10 V to 15 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI (D, DE, R, or RE)
−0.3 V to VCC + 0.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrostatic discharge: Bus terminals and GND, Class 3, A: (see Note 2)
12 kV
. . . . . . . . . . . . . . . . . . . . . . . .
Bus terminals and GND, Class 3, B: (see Note 2)
400 V
. . . . . . . . . . . . . . . . . . . . . . . .
All terminals, Class 3, A:
4 kV
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
All terminals, Class 3, B:
400 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation (see Note 3)
See Dissipation Rating Table
. . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg (see Note 4)
−65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
260
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. All voltage values, except differential I/O bus voltage, are with respect to network ground terminal.
2. The maximum operating junction temperature is internally limited. Use the dissipation rating table to operate below this temperature.
3. Tested in accordance with MIL−STD−883C, Method 3015.7
4. Long-term, high-temperature storage and/or extended use at maximum recommended operating conditions may result in a
reduction of overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.
DISSIPATION RATING TABLE
PACKAGE
TA ≤ 25°C
POWER RATING
DERATING FACTOR‡
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
TA = 125°C
POWER RATING
D
725 mW
5.8 mW/
°C
464 mW
377 mW
145 mW
‡ This is the inverse of the junction-to-ambient thermal resistance when the board is mounted and with no air flow.
1/TJ in °K
OPERATING LIFE DERATING TABLE − SN65LBC176AMDREP
1/tf vs 1/TJ in °K
140
°C (29.1k Hrs, 3.3 Yrs)
0.000001
0.00001
0.0001
135
°C (51.0k Hrs, 5.8 Yrs)
130
°C (90.1k Hrs, 10.3 Yrs)
125
°C (161.8 kHrs, 18.5 Yrs)
R = 0.9881
NOTES: A. See the data sheet for absolute maximum and maximum recommended operating conditions.
B. Silicon operating life design goal is 10 years at 105
°C junction temperature (does not include package interconnect life).
C. Attached enhanced plastic product disclaimer applies.



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