5.7

Placement of components on circuit board

It is of advantage to place the components on the board before soldering so that their two termi-

nals do not enter the solder oven at different times. Ideally, both terminals should be wetted si-

multaneously.

5.8

Soldering caution

Sudden heating or cooling of the component results in thermal destruction by cracks.

An excessively long soldering time or high soldering temperature results in leaching of the out-

er electrodes, causing poor adhesion due to loss of contact between electrodes and termina-

tion.

Avoid manual soldering with a soldering iron.

Wave soldering must not be applied for CeraDiodes designated for reflow soldering only.

Keep to the recommended down-cooling rate.

5.9

Standards

CECC 00802

IEC 60068-2-58

IEC 60068-2-20

JEDEC J-STD-020D

CeraDiodes

High-speed series

Page 17 of 22

Please read Cautions and warnings and

Important notes at the end of this document.