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TDA7266SAN Datasheet(PDF) 11 Page - STMicroelectronics

Part # TDA7266SAN
Description  5 W 5 W dual bridge amplifier
PDF  15 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

TDA7266SAN Datasheet(HTML) 11 Page - STMicroelectronics

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TDA7266SAN
Heatsink dimensioning
Doc ID 023621 Rev 1
11/15
7
Heatsink dimensioning
In order to avoid triggering the thermal protection which is set approximatively at Tj = 150°C,
it is important to correctly dimension the heat sinker RTh (°C/W).
The parameters that influence the dimensioning are:
●
Maximum dissipated power for the device (Pdmax)
●
Max. thermal resistance junction to case (RTh j-c)
●
Max. ambient temperature Tamb max
●
Quiescent current Iq (mA)
Example:
VCC = 9.5 V, Rload = 8 ohm, RTh j-c = 2.5 °C/W , Tamb max = 50 °C
Figure 14 shows the power derating curve for the device.
Figure 14.
Power derating curve
P
dmax
N
o
channels
()
V
CC
2
Π
2
R
load
2
--------------
•
---------------------------
•
I
q
V
CC
•
+
=
P
dmax
22.3
()
•
0.47
5.07W
=
+
=
HeatSinker
()R
Th c
a
–
150
T
amb max
–
P
dmax
------------------------------------------
R
Th j
c
–
150
50
–
5.07
----------------------
2.5
–
⎝⎠
⎛⎞
17.2
o
C/W
=
=
–
=
a)
Infinite Heatsink
b)
7 °C/ W
c)
10 °C/ W
(c)
(a)
(b)
0
5
10
15
20
25
040
80
120
160
Tamb (°C)
a)
Infinite Heatsink
b)
7 °C/ W
c)
10 °C/ W
(c)
(a)
(b)
0
5
10
15
20
25
040
80
120
160
Tamb (°C)



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